Replacement of Cu with One-Step Production of CuAg (Ag0.04Cu3.96): Superior Conductivity, Corrosion Resistance, and Hardness

Copper is the forefront of the fundamental metals used in various industries. It is utilized as bulk or electrodeposited on PCBs or interconnects. However, poor corrosion resistance and hardness reduce copper performance and limit its applicability in the fields that require mechanical strength, such as probing applications. Facile electrochemical deposition of Cu(Ag) films was examined in a deep eutectic solvent known for its green nature. SEM–EDS technique was applied for morphostructural and crsytal plane analysis. XRD analysis revealed Cu3.96Ag0.04 phase, and 2% Ag was identified in the Cu(Ag) film in EDS. Four-prope point resistivity analysis was performed via galvano-impedance spectroscopy. Obtained resistivity value of 5 µm thick Cu(Ag) coating was lower than the compliance limit of International Technology Roadmap for Semiconductors. Corrosion analysis was carried out via electrochemical impedance spectroscopy technique, and Cu(Ag) films demonstrated better resistance. Hardness tests also revealed that Cu(Ag) was approximately two times harder than Cu. Graphical Abstract: [Figure not available: see fulltext.]