Smart alloy metalized novel photonic NEMS photodiode with CuAlV/n-Si/Al junction structure

MakaleAçık ErişimScopus SJRQ2

Özet

In this work, a novel smart (shape memory) alloy metalized photonic silicon wafer photodiode with Schottky type CuAlV/n-Si/Al contact structure as a nano-electro-mechanical-system (NEMS) photodevice was fabricated by thermal evaporation technique. The CuAlV memory alloy used as the top Schottky metal contact electrode was produced by arc melting technique and a subsequent quenching in an iced-brine water medium, and its shape memory effect characteristics were revealed by thermal and structural tests. The fabricated photonic NEMS photodiode was characterized by different photo-electrical (I-V, I-t) and frequency/time dependent and illuminated capacitance (C-V/f, C-t, C-V/ill.) and conductance-voltage (G-V) measurements under different frequencies and artificial light intensity power conditions. The I-V tests showed an excellent current rectifying ability and very well net photocurrent generation features of the photodiode. The specific detectivity of the photodiode was found as high as almost approaching 1011 Jones. The SCLC (space charge limited current conduction) analyses made on the double-log I-V plots of the photodiode revealed that the trap-filling TFL-SCLC and trap-free SCLC current conduction mechanisms are the two prevailing conduction mechanisms in the forward bias voltage region. The density of interface states (Dit) of the fabricated photodiode was determined. Moreover, an excellent reproducibility of light-induced photocapacitance formation of the novel photodiode was demonstrated by C-V/t measurements under different artificial light power intensities.

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RDL Kalıcı Bağlantı (PID)
https://rdlopen.rawdatalibrary.net/r/munzur/2029Resmi atıflarda kullanılan kalıcı adres
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https://doi.org/10.1088/1402-4896/ad2047Yayıncı resmi DOI adresi
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AlanDeğerDil
dc.contributor.authorKaraduman, Oktay
dc.contributor.authorCanbay, Canan Aksu
dc.contributor.authorDere, Aysegul
dc.contributor.authorOrman, Yusuf
dc.contributor.authorAl-Ghamdi, Ahmed A
dc.contributor.authorAl-Sehemi, Abdullah G
dc.contributor.authorYakuphanoglu, Fahrettin
dc.date.accessioned2026-10-28T14:54:51.188423139Z
dc.date.available2026-10-28T14:54:51.188423139Z
dc.date.issued2024
dc.description.abstractIn this work, a novel smart (shape memory) alloy metalized photonic silicon wafer photodiode with Schottky type CuAlV/n-Si/Al contact structure as a nano-electro-mechanical-system (NEMS) photodevice was fabricated by thermal evaporation technique. The CuAlV memory alloy used as the top Schottky metal contact electrode was produced by arc melting technique and a subsequent quenching in an iced-brine water medium, and its shape memory effect characteristics were revealed by thermal and structural tests. The fabricated photonic NEMS photodiode was characterized by different photo-electrical (I-V, I-t) and frequency/time dependent and illuminated capacitance (C-V/f, C-t, C-V/ill.) and conductance-voltage (G-V) measurements under different frequencies and artificial light intensity power conditions. The I-V tests showed an excellent current rectifying ability and very well net photocurrent generation features of the photodiode. The specific detectivity of the photodiode was found as high as almost approaching 1011 Jones. The SCLC (space charge limited current conduction) analyses made on the double-log I-V plots of the photodiode revealed that the trap-filling TFL-SCLC and trap-free SCLC current conduction mechanisms are the two prevailing conduction mechanisms in the forward bias voltage region. The density of interface states (Dit) of the fabricated photodiode was determined. Moreover, an excellent reproducibility of light-induced photocapacitance formation of the novel photodiode was demonstrated by C-V/t measurements under different artificial light power intensities.
dc.description.sponsorshipFirat University Scientific Research Projects Management Unit, FÜBAP, (ADEP-23.03)
dc.description.sponsorshipFirat University Scientific Research Projects Management Unit, FÜBAP
dc.identifier.articlenumber025993
dc.identifier.doi10.1088/1402-4896/ad2047
dc.identifier.eissn1402-4896
dc.identifier.issn0031-8949
dc.identifier.issue2
dc.identifier.scopus2-s2.0-85184012312
dc.identifier.urihttps://rdlopen.rawdatalibrary.net/r/munzur/2029
dc.identifier.volume99
dc.identifier.wosWOS:001153047200001
dc.language.isoen
dc.publisherInstitute of Physics
dc.relation.ispartofPhysica Scripta
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectCu-based SMA
dc.subjectdetectivity
dc.subjectinterface states
dc.subjectNEMS schottky photodiode
dc.subjectphotocapacitance
dc.subjectspace charge limited current conduction (SCLC)
dc.subject.otherAluminum alloys
dc.subject.otherCapacitance
dc.subject.otherCopper alloys
dc.subject.otherInterface states
dc.subject.otherMetallizing
dc.subject.otherPhotodiodes
dc.subject.otherSilicon wafers
dc.subject.otherCu-based
dc.subject.otherCu-based SMA
dc.subject.otherCurrent conduction
dc.subject.otherDetectivity
dc.subject.otherInterfaces state
dc.subject.otherNano-electro-mechanical systems
dc.subject.otherNano-electro-mechanical-system schottky photodiode
dc.subject.otherPhotocapacitance
dc.subject.otherSchottky photodiodes
dc.subject.otherSpace charge limited current conduction
dc.subject.otherSpace-charge-limited current
dc.subject.otherThermal evaporation
dc.titleSmart alloy metalized novel photonic NEMS photodiode with CuAlV/n-Si/Al junction structure
dc.typeArticle
rdl.citation.openalex5
rdl.citation.scopus5
rdl.oa.statushybrid
rdl.oa.statusclosed
rdl.oa.statusgreen
rdl.oa.urlhttps://hdl.handle.net/11508/58526
rdl.scopus.quartileQ2
rdl.source.indexSCOPUS
rdl.source.indexWOS