Tribological Performance of SPS-Fabricated Cu-HEA/Gr Composites Under Current-Carrying Sliding Contact

Cu-based hybrid composites reinforced with AlCrFeCuNi high-entropy alloy (HEA) particles and graphene were successfully fabricated by spark plasma sintering (SPS) to investigate the combined effects of microstructure, mechanical properties, and tribological performance under electrical current. Microstructural observations revealed a dense and homogeneous distribution of HEA particles within the Cu matrix, while the addition of 2.0 wt.% graphene promoted noticeable grain refinement due to its grain boundary pinning effect. Although graphene addition provided beneficial effects in terms of grain refinement and electrical conductivity, it also increased the porosity from 2.49% to 5.08%. Consequently, the beneficial contribution of graphene to mechanical strengthening was substantially offset by the adverse effect of increased porosity, resulting in only a marginal increase in hardness from 127 HB to 129 HB. The addition of 2.0 wt.% graphene led to a pronounced change in the tribological behavior of the composites. The Cu–HEA exhibited relatively stable friction behavior but experienced a higher wear rate under all test conditions. In comparison, the Cu–HEA–2.0 Gr composite demonstrated a lower coefficient of friction and wear rate at 0–10 A, which is consistent with the possible formation of a graphene-rich lubricating surface layer. A clear transition occurred at 30 A, where the coefficient of friction and wear rate began to increase, while at 50 A, further increases in both parameters were observed, suggesting progressive disruption of the proposed protective surface layer under the investigated current-carrying sliding conditions.